Post-Processed Integrated Microsystems

This report represents the completion of a three-year Laboratory-Directed Research and Development (LDRD) program to develop a low cost platform for integrated microsystems that is easily configured to meet a wide variety of specific applications-driven needs. Once developed, this platform, which incorporates many of the elements that are common to numerous microsystems, will enable integrated microsystem users access to this technology without paying the high up-front development costs that are now required. The process starts with the fabrication, or acquisition, of wafers which have sparsely placed device or circuit components fabricated in any foundried technology (Si CMOS or bipolar technologies, high-frequency GaAs technologies, MEMS, etc.). We call these “smart substrates.” Using the diverse processing capabilities of SNL, we then intend to “post-process” high-value components in open areas on the front or back of the wafers and microelectronically integrate the added components with the pre-placed circuitry. Examples of post-processed components include sensors, antennas, SAW devices, passive elements, micro-optics, and surface-mounted hybrids. The combination of preplaced electronics and post-processed components will enable the development of many new types of integrated microsystems. Targeted applications include integrated sensor systems, tags, and electromechanical systems.